Samsung ‘3D’ Memory Coming, 50% Denser

Samsung today announced a new 8GB dual inline memory module (DIMM) that stacks memory chips on top of each other, which increases the density of the memory by 50% compared to conventional DIMM technology. Samsung is using its Green Memory process to fabricate the chips to learn more about their fabrication process look here: http://www.samsung.com/global/business/semiconductor/Greenmemory/main.html. Samsung’s Green memory technology greatly reduces the amount of power used by each memory chip. This can have a huge saving effect in server farms and high density computer labs. Samsung is claiming 86% energy saving over current generation chips.

Samsung is able to achieve this by using a new process called Through-silicon via(wikipedia article: http://en.wikipedia.org/wiki/Through-silicon_via) which is a new way of creating 3D packages and 3D integrated circuits. Translated they are able to pack more memory into a smaller space and make it more energy efficient. This should have an effect on heating and cooling as well as energy savings to begin with because the chips will produce less heat from use.

Here is some coverage of the announcement:
Samsung press release: http://www.samsung.com/us/news/newsRead.do?news_seq=19766&page=1&gltype=globalnews
ComputerWorld coverage here: http://www.computerworld.com/s/article/9200278/Samsung_to_release_3D_memory_modules_with_50_greater_density

Samsung today announced a new 8GB dual inline memory module (DIMM) that stacks memory chips on top of each other, which increases the density of the memory by 50% compared to conventional DIMM technology. Samsung is using its Green Memory process to fabricate the chips to learn more about their fabrication process look here: http://www.samsung.com/global/business/semiconductor/Greenmemory/main.html. Samsung’s Green memory technology greatly reduces the amount of power used by each memory chip. This can have a huge saving effect in server farms and high density computer labs. Samsung is claiming 86% energy saving over current generation chips.

Samsung is able to achieve this by using a new process called Through-silicon via(wikipedia article: http://en.wikipedia.org/wiki/Through-silicon_via) which is a new way of creating 3D packages and 3D integrated circuits. Translated they are able to pack more memory into a smaller space and make it more energy efficient. This should have an effect on heating and cooling as well as energy savings to begin with because the chips will produce less heat from use.

Here is some coverage of the announcement:
Samsung press release: http://www.samsung.com/us/news/newsRead.do?news_seq=19766&page=1&gltype=globalnews
ComputerWorld coverage here: http://www.computerworld.com/s/article/9200278/Samsung_to_release_3D_memory_modules_with_50_greater_density